Week 8 FYP II

Title of activity:

Assembling and soldering the component on printed PCB.


Objectives:  

1. To put the component at the correct hole.
2. To make sure all the connection are all closed so that the voltage and current can flow.


Content/Procedure:


1. Prepare the solder gun and PCB board with all the component.

2. Compare the component's diagram with the drilled PCB board.

3. Prepare all the component needed.

4. Make sure all the drilled PCB is matched to the circuit.

5. Assembling the resistor.

6. Assembling the diode.

6. Assembling the  18 pF capacitor (no pole).

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7. Assembling the oscillator.

8. Assembling the 0.1 µF capacitor. ( no pole )

9. Connecting all the circuit with connector.

10. Assembling the adapters.

11. Assembling the 1 µF electrolytic capacitor.

12. Assembling the 1000 µF electrolytic capacitor.

13. Assembling the transistor

14. Assembling the PIC 16F877A 's base.

15. Printed PCB before soldered ( front view )

16. Printed PCB after soldered ( back view )

FINALE

Conclusion:


After all the soldered component already done, I have to make sure all the connection from the PCB board to the RFID reader and to the PC software is correct.