Week 8 FYP II

Title of activity:

Assembling and soldering the component on printed PCB.


Objectives:  

1. To put the component at the correct hole.
2. To make sure all the connection are all closed so that the voltage and current can flow.


Content/Procedure:


1. Prepare the solder gun and PCB board with all the component.

2. Compare the component's diagram with the drilled PCB board.

3. Prepare all the component needed.

4. Make sure all the drilled PCB is matched to the circuit.

5. Assembling the resistor.

6. Assembling the diode.

6. Assembling the  18 pF capacitor (no pole).

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7. Assembling the oscillator.

8. Assembling the 0.1 µF capacitor. ( no pole )

9. Connecting all the circuit with connector.

10. Assembling the adapters.

11. Assembling the 1 µF electrolytic capacitor.

12. Assembling the 1000 µF electrolytic capacitor.

13. Assembling the transistor

14. Assembling the PIC 16F877A 's base.

15. Printed PCB before soldered ( front view )

16. Printed PCB after soldered ( back view )

FINALE

Conclusion:


After all the soldered component already done, I have to make sure all the connection from the PCB board to the RFID reader and to the PC software is correct. 

Week 7 FYP II

Title of activity: 

Assembling the component on bread board


Objectives:  
1. To make sure all the component have connection among them.
2. To light up the LED


Content / Procedure :

Below is the components that has been assembled on the breadboard.

Next picture is the close view of component on the bread board.

The next picture is when there is voltage supply from battery 9Volts.

The closer view of those closed circuit.

Conclusion:

Frankly speaking, the component assembled on the bread board is only the Part A which was the voltage supplier. To recall, Part A is the part where the high voltage (9V) power supply from battery was stepped down to 5V. This is because all the components cannot withstand over voltage from power supply. That is the function of voltage regulator.

Week 6 FYP II

Title of activity: 

Fabrication of PCB.


Objectives: 


1. To study the method for fabrication.
2. To present the result of fabrication.


Procedure:


1. PCB drawing: is designed by Protel DXP 2005. Once all the drawing was confirmed, it is now ready for print out. Print the layout on the A4 size transparent OHP paper. 


2. Tools required:

• Fluorescent light
• UV PCB 
• Marker pen
• Blade 
• OHP transparent paper
• Iron (III) Chloride FeCl₃ acid.
• Clean water
• Thinner
• Plastic container 
• Laser printer
• PCB cutter and trimmer 

3. PCB cutting: Cut photo PCB size according to the film size.

Cut the film PCB according to size

Cut the OHP paper according to PCB size

4.  PCB Photo Etching: Expose the photo PCB in photo etching kit for 8-10minutes.

Etching kit

Exposing the photo PCB in 8-10 minutes.

5.   PCB Developing: Wash the PCB using PCB developer (white powder) for 2 minutes.

6. Acid Etching:

• print image on PCB copper board
• prepare the iron (III) chloride solution
• add in hot water
• shake the water until see unused part is washed and left only the tracks. 

The concentration of iron (III) chloride will determine rate of chemical reaction. In this etching process, the chemical reaction involve in the etch process is:

     FeCl₃ + Cu ® FeCl₂ + CuCl

Where FeCl₃ is the iron (III) chloride, Cu is copper, FeCl₂ is iron (II) chloride and CuCl is a copper chloride.

PCB copper board with iron (III) chloride.

After etching

7. Thinner Washing: This is a process to remove the black ink on the PCB board. The black ink has to be removed in order to solder the components. The green coating on PCB can be removed by alcoholic solution and leaving only the PCB trace. After remove the black ink, the PCB is then send for cleaning using normal water.

8. Drilling: Drill PCB after alcohol washing, use drill bit 0.8mm, 1.0mm and 1.2mm.

9. Final result:

Conclusion: 

    We already done with the printed PCB board. Next is to assemble all the component on breadboard, and PCB board!